Archives: Product Bulletins
Electroless Copper 8100A
Electroless Copper 8100 is a two component, room temperature electroless copper system designed for the flash plating of printed circuit boards. The bath deposits a bright, ductile, fine grained copper flash which guarantees void–free coverage of thru holes and provides a conductive surface for subsequent electroplating.
Electroless Copper 8100B
Electroless Copper 8100 is a two component, room temperature electroless copper system designed for the flash plating of printed circuit boards. The bath deposits a bright, ductile, fine grained copper flash which guarantees void–free coverage of thru holes and provides a conductive surface for subsequent electroplating.
Bernite 29
System II Alpha
System II solder stripper system is a two–step liquid acidic product developed for dissolving solder from circuit boards and contact fingers by immersion. Solder stripping occurs mainly in the Alpha component, while the Delta component removes the adhering tin compounds.
Hallstrip SS 400
Microetch 6075
System II – DELTA
System II solder stripper system is a two–step liquid acidic product developed for dissolving solder from circuit boards and contact fingers by immersion. Solder stripping occurs mainly in the Alpha component, while the Delta component removes the adhering tin compounds.
Aquapure DW-23
AQUAPURE DF-P
Aquapure DF-P is a non-silicone defoamer formulated for application as a tank side additive for metal working fluids, alkaline / acid-based cleaners or wastewater treatment chemicals. It will not haze or separate from the concentrate during storage. When used at the prescribed levels in process chemistry, Aquapure DF-P will not impair subsequent finishing operations such… Read more »